600mm/s Fiber laser scribing machine
It is suitable for single crystal&polycrystalline silicon solar cell and silicon wafer scribing. It can chamfer single crystal, line scribing, manual feeding, manual bar positioning scribing.
1). Marble bearing platform and Taiwan Shangyin KK module ensures high-speed operation stability and accuracy.
2). Integrated high-speed and low-voltage servo, effectively preventing the motion encoder harness from fatigue.
3). Direct in optical fiber focal length fine-tuning system, no optical path offset adjustment unit, reduce the failure.
4). 200mm, 300mm, 400mm speed options, support single crystal chamfering, simple software interface, various programming methods.
5). Auto electronic foot pedal, auto suction to improve efficiency.
Laser power: 30W customized,10% - 100% continuously adjustable
Laser wavelength: 1064nm
Cutting speed: max. 600 mm/s
Scribing depth: 1 / 2-1 / 3
Scribing accuracy: + - 0.05mm
Positioning mode: mechanical positioning
Laser frequency: 20-80khz adjustable
Slicing capacity: 1000 pieces of half pieces per hour
Cell specification: 156 * 156,125*125 non-standard cells&chamfers, silicon wafer
Compressed air: 0.6-0.8mpa, gas consumption 300L / min
Power supply: 220V 50Hz 2KW
Size: 1000 * 850 * 1380mm
Net weight: 200kg