Two-Station Auto laser scribing Machine
It is suitable for the scribing of single crystal& polycrystalline silicon solar cells and silicon wafers. It can chamfer single crystal, draw straight lines, double whole box cyclic loading, auto mechanical positioning slicing and auto whole box unloading.
1). Fast speed: slice speed up to 1600 slices / hour.
2). One person can control multiple equipment,whole cell box feeding and picking.
3). Reduce the damage and pollution caused by manual loading and unloading
4). The glass cutting platform reduces scratch on the surface of cells.
5). Core customized laser, 600 mm/s ultra-high cutting speed is unique on the market.
6). It has manual and auto mode switching function, convenient to modify small pieces occasionally.
Laser power: 30W customized,10% - 100% continuously adjustable
Laser wavelength: 1064nm
Cutting speed: max. 600 mm/s
Scribing depth: 1 / 2-1 / 3
Scribing accuracy: + - 0.2 mm
Positioning mode: mechanical positioning
Laser frequency: 20-80khz adjustable
Slicing capacity: 1600 pieces of half pieces per hour
Cell specification: 156 * 156,125*125 non-standard cells&chamfers, silicon wafer
Compressed air: 0.6-0.8mpa, gas consumption 400L / min
Power supply: 220V 50Hz 2KW
Size: 1250 * 1100 * 1380mm
Net weight: 300kg