Because the laser is focused by a special optical system to become a very small light point, with high energy density, because its processing is non-contact, there is no mechanical impact pressure on the workpiece itself, and the workpiece is not easy to deform. It is widely used in the cutting and scribing of solar panels and thin metal sheets.
Laser scribing machine is mainly used for scribing and cutting metal materials, silicon, germanium, gallium arsenide and other semiconductor substrate materials. It can process solar panels, silicon chips, ceramic chips, aluminum foil, etc. the workpieces are fine and beautiful, and the cutting edge is smooth. A CW Q-switched Nd: YAG laser is used as the working light source. The two-dimensional table is controlled by a computer, which can perform various movements according to the input figures. It has high output power, high precision and high speed. It can cut curves and straight lines.
Laser scribing machine is generally divided into these categories: YAG laser scribing machine, semiconductor laser scribing machine, fiber laser scribing machine.