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China laser scribing machine introduction
[ 信息来源:China laser scribing machine introduction    点击数:71    更新时间:2018-05-10 ]

Laser scribing machine is generally divided into these categories: YAG laser scribing machine, semiconductor laser scribing machine, fiber laser scribing machine.

Fiber laser

Features

1.High configuration: imported fiber laser, better beam quality (standard fundamental mode), thinner slit (30 μ m), smoother edge.

2.Maintenance free: the whole machine adopts the international standard modular design, truly maintenance free, uninterrupted continuous operation, and no consumable wearing parts replacement.

3.Easy to operate: the equipment is integrated with air-cooled settings, the equipment is smaller, and the operation is simpler.

4.Special control software: the control software specially designed for laser scriber is easy to operate and can display the path of scribe in real time.

5.High working efficiency: T-shaped table operates alternately with two working positions to improve working efficiency. The maximum cutting speed can reach 200 mm / s.

Application and market:

In the solar energy industry, monocrystalline silicon, polycrystalline silicon, amorphous silicon ribbon solar cells and silicon chips are sliced (cut, sliced).

Semiconductor laser

Features

1.High configuration: new semiconductor material imported, greatly improving the electro-optic conversion efficiency.

2.Stable operation: fully closed optical path design, optical brazing transmission, ensure long-term continuous and stable operation of the laser, stronger adaptability to the environment. The whole machine adopts international standard modular design, reasonable structure, more convenient and simple installation and maintenance.

3.High efficiency: low current, high efficiency. Low working current, high speed (up to 220mm / s), basically maintenance free, no material loss, zero failure rate, and lower operation cost.

Application and market:

In the solar energy industry, monocrystalline silicon, polycrystalline silicon, amorphous silicon ribbon solar cells and silicon chips are sliced (cut, sliced).

YAG laser

Features:

1.High end configuration: the core components (focus cavity) are made of imported new materials, which greatly improves the electro-optical conversion efficiency. The laser adopts a new generation of metal plated focus cavity, which avoids gold removal and is more durable.

2.Professional control software: the control software is specially designed according to the characteristics of the industry, with friendly human-computer interface and convenient operation. It is convenient for the design, change and monitoring of the cutting path.

3.Low operation cost: small working current (less than 11a), fast speed (up to 140mm / s), extended service life of krypton lamp, reduced maintenance, material loss, reduced failure rate, reduced operation cost.

4.Humanized design: unique prompt function to ensure timely replacement of vulnerable parts.

Application and market:

1.In the solar energy industry, monocrystalline silicon, polycrystalline silicon, amorphous silicon ribbon solar cells and silicon chips are sliced (cut, sliced).

2.Separation and cutting of monocrystalline silicon and polycrystalline silicon in electronic industry.


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